ansys.mapdl.core.Mapdl.etable#

Mapdl.etable(lab='', item='', comp='', option='', **kwargs)#

Fills a table of element values for further processing.

Mechanical APDL Command: ETABLE

Parameters:
labstr

Any unique user-defined label for use in subsequent commands and output headings. A valid label has a maximum of eight characters and is not a general predefined Item label. Default: An eight- character label formed by concatenating the first four characters of the Item and Comp labels.

If the same as a previous user label, the result item is included under the same label. Up to 200 different labels can be defined.

The following predefined labels are reserved:

  • REFL - Refills all tables previously defined with the etable commands (not the calc module commands) according to the latest etable specifications. It is convenient for refilling tables after the load step ( Set displays ) has changed. Remaining fields are ignored.

  • STAT - Displays stored table values.

  • ERAS - Erases the entire table.

itemstr

Label identifying the item. General item labels are shown in the tables below. Some items also require a component label. Character parameters are valid. Item = ERAS erases a Lab column.

compstr

Component of the item (if required). General component labels are shown in the tables below. Character parameters can be used.

optionstr

Option for storing element table data:

  • MIN - Store minimum element nodal value of the specified item component.

  • MAX - Store maximum element nodal value of the specified item component.

  • AVG - Store averaged element centroid value of the specified item component (default).

Notes

etable defines a table of values per element (the element table) for use in further processing. The element table is organized similar to a spreadsheet, with rows representing all selected elements and columns consisting of result items which have been moved into the table ( Item, Comp ) via etable. Each column of data is identified by a user-defined label ( Lab ) for listings and displays.

After entering the data into the element table, you are not limited to listing or displaying your data ( plesol, presol, etc.). You can also perform many types of operations on your data, such as adding or multiplying columns ( sadd, smult ), defining allowable stresses for safety calculations ( sallow ), or multiplying one column by another ( smult ). For more information, see Getting Started

For reinforcing elements, this command displays the results of reinforcing member (individual reinforcing) selected via the layer, N command (where N is a given reinforcing member). layer,0 (default) or layer,1 selects the first reinforcing member.

Various results data can be stored in the element table. For example, many items for an element are inherently single-valued (one value per element). The single-valued items include: SERR, SDSG, TERR, TDSG, SENE, TENE, KENE, ASENE, PSENE, AKENE, PKENE, DENE, WEXT, AENE, JHEAT, JS, VOLU, and CENT. All other items are multivalued (varying over the element, such that there is a different value at each node). Because only one value is stored in the element table per element, an average value (based on the number of contributing nodes) is calculated for multivalued items. Exceptions to this averaging procedure are FMAG and all element force items, which represent the sum only of the contributing nodal values.

Two methods of data access can be used with the etable command. The method you select depends upon the type of data that you want to store. Some results can be accessed via a generic label (Component Name method), while others require a label and number (Sequence Number method).

The component name method is used to access the general element data (that is, element data which is generally available to most element types or groups of element types). All of the single-valued items and some of the more general multivalued items are accessible with the Component Name method. Various element results depend on the calculation method and the selected results location ( avprin, rsys, layer, shell, and esel ).

Although nodal data is readily available for listing and display ( prnsol, plnsol ) without using the element table, you can also use the Component Name method to enter these results into the element table for further “worksheet” manipulation. (See Getting Started Item and Comp labels for the component name method is shown in ETABLE - General Result Item and Component Labels. See ETABLE - Selected Result Component Labels for a list of selected result ( Item = SRES) Comp labels.

The sequence number method enables you to view results for data that is not averaged (such as pressures at nodes, temperatures at integration points, etc.), or data that is not easily described in a generic fashion (such as all derived data for structural line elements and contact elements, all derived data for thermal line elements, layer data for layered elements, etc.). A table illustrating the Items (such as LS, LEPEL, LEPTH, SMISC, NMISC, SURF, etc.) and corresponding sequence numbers for each element is shown in the Output Data section of each element description.

Some element table data are reported in the results coordinate system. These include all component results (for example, UX, UY, etc.; SX, SY, etc.). The solution writes component results in the database and on the results file in the solution coordinate system. When you issue the etable command, these results are then transformed into the results coordinate system ( rsys ) before being stored in the element table. The default results coordinate system is global Cartesian ( rsys,0). All other data are retrieved from the database and stored in the element table with no coordinate transformation.

To display the stored table values, issue the pretab, pletab, or etable,STAT command. To erase the entire table, issue etable,ERAS. To erase a Lab column, issue etable, Lab,ERAS.

When the GUI is enabled, if a Delete operation in a Define Element Table Data dialog box writes this command to a log file ( Jobname.LOG or Jobname.LGW ), the program sets Lab = blank, Item = ERASE, and Comp = an integer number. In this case, the program has assigned a value of Comp that corresponds to the location of a chosen variable name in the dialog list. It is not intended that you type in such a location value for Comp in a session; however, a file that contains a GUI-generated etable command of this form can be used for batch input or the input command.

The MIN and MAX options are not available for thermal elements.

The element table data option ( Option ) is not available for all output items. See the table below for supported items.

ETABLE - General Result Item and Component Labels#

General Item and Component Labels etable, Lab, Item, Comp#

Item

Comp

Description

Valid Item Labels for Degree of Freedom Results

U

X, Y, Z

X, Y, or Z structural displacement.

ROT

X, Y, Z

X, Y, or Z structural rotation.

TEMP For SHELL131 and SHELL132 elements with KEYOPT(3) = 0 or 1, use labels TBOT, TE2, TE3, …, TTOP instead of TEMP.

Temperature.

PRES

Pressure.

VOLT

Electric potential.

GFV1, GFV2, GFV3

Nonlocal field values 1, 2, and 3.

MAG

Magnetic scalar potential.

V

X, Y, Z

X, Y, or Z fluid velocity.

A

X, Y, Z

X, Y, or Z magnetic vector potential.

CONC

Concentration.

CURR

Current.

EMF

Electromotive force drop.

Valid Item and Component Labels for Element Results

S Element table option ( Option ) is available for this element output data item.

X, Y, Z, XY, YZ, XZ

Component stress.

1, 2, 3

Principal stress.

INT

Stress intensity.

EQV

Equivalent stress.

EPEL

X, Y, Z, XY, YZ, XZ

Component elastic strain.

1, 2, 3

Principal elastic strain.

INT

Elastic strain intensity.

EQV

Elastic equivalent strain.

EPTH

X, Y, Z, XY, YZ, XZ

Component thermal strain.

1, 2, 3

Principal thermal strain.

INT

Thermal strain intensity.

EQV

Thermal equivalent strain.

EPDI

X, Y, Z, XY, YZ, XZ

Component diffusion strain.

1, 2, 3

Principal diffusion strain.

EQV

Diffusion equivalent strain.

INT

Diffusion strain intensity.

EPPL

X, Y, Z, XY, YZ, XZ

Component plastic strain.

1, 2, 3

Principal plastic strain.

INT

Plastic strain intensity.

EQV

Plastic equivalent strain.

EPCR

X, Y, Z, XY, YZ, XZ

Component creep strain.

1, 2, 3

Principal creep strain.

INT

Creep strain intensity.

EQV

Creep equivalent strain.

EPSW

Swelling strain.

EPTO

X, Y, Z, XY, YZ, XZ

Component total mechanical strain ( excluding thermal) (EPEL + EPPL + EPCR).

1, 2, 3

Principal total mechanical strain.

INT

Total mechanical strain intensity.

EQV

Total equivalent mechanical strain.

EPTT

X, Y, Z, XY, YZ, XZ

Component total strain including thermal, diffusion, and swelling (EPEL + EPTH + EPPL + EPDI + EPCR + EPSW).

1, 2, 3

Principal total strain.

INT

Total strain intensity.

EQV

Total equivalent strain.

NL

SEPL

Equivalent stress (from stress-strain curve).

SRAT

Stress state ratio.

HPRES

Hydrostatic pressure.

EPEQ

Accumulated equivalent plastic strain.

SEND

ELASTIC The results for this postprocessing SEND component are invalid for ELBOW290 when that element is used with viscoelastic or viscohyperelastic materials.

Elastic strain energy density. (For viscoelastic and sintering materials, the stored energy.)

PLASTIC

Plastic strain energy density.

CREEP

Creep strain energy density.

DAMAGE

Damage strain energy density.

VDAM

Viscoelastic dissipation energy density.

VREG

Visco-regularization strain energy density.

DISS

Structural-thermal dissipation.

ENTO

Total strain energy density (sum of ELASTIC, PLASTIC, and CREEP strain energy densities).

SVAR

1 to MAX

State variable.

CDM

DMG

Damage variable.

LM

Maximum previous strain energy for virgin material.

FAIL

MAX For MPC-based contact definitions, the value of STAT can be negative. This indicates that one or more contact constraints were intentionally removed to prevent overconstraint. STAT = -3 is used for MPC bonded contact; STAT = -2 is used for MPC no-separation contact.

Maximum of all active failure criteria defined at the current location ( fctyp ).

EMAX

Maximum Strain Failure Criterion.

SMAX

Maximum Stress Failure Criterion.

TWSI

Tsai-Wu Strength Index Failure Criterion.

TWSR

Inverse of Tsai-Wu Strength Ratio Index Failure Criterion.

HFIB Some element- and material-type limitations apply. For more information, see prerr.

Hashin Fiber Failure Criterion.

HMAT

Hashin Matrix Failure Criterion.

PFIB

Puck Fiber Failure Criterion.

PMAT

Puck Matrix Failure Criterion.

L3FB

LaRc03 Fiber Failure Criterion.

L3MT

LaRc03 Matrix Failure Criterion.

L4FB

LaRc04 Fiber Failure Criterion.

L4MT

LaRc04 Matrix Failure Criterion.

USR1, USR2,…, USR9 When using the emft procedure to calculate electromagnetic force ( PLANE121, SOLID122, SOLID123, PLANE233, SOLID236 or SOLID237 elements only), the FMAG sum will be zero or near zero.

User-defined failure criteria.

PFC

MAX Failure criteria are based on the effective stresses in the damaged material.

Maximum of all failure criteria defined at current location.

FT

Fiber tensile failure criteria.

FC

Fiber compressive failure criteria.

MT

Matrix tensile failure criteria.

MC

Matrix compressive failure criteria.

PDMG

STAT

Damage status (0 = undamaged, 1 = damaged, 2 = completely damaged).

FT

Fiber tensile damage variable.

FC

Fiber compressive damage variable.

MT

Matrix tensile damage variable.

MC

Matrix compressive damage variable.

S

Shear damage variable (S).

SED

Energy dissipated per unit volume.

SEDV

Energy per unit volume due to viscous damping.

FCMX

LAY

Layer number where the maximum of all active failure criteria over the entire element occurs.

FC

Number of the maximum-failure criterion over the entire element: * 1 - EMAX * 2 - SMAX * 3 - TWSI * 4 - TWSR * 5 - PFIB * 6 - PMAT * 7 - HFIB * 8 - HMAT * 9 - L3FB * 10 - L3MT * 11 - L4FB * 12 - L4MT * 13~21 - USR1~USR9

VAL

Value of the maximum failure criterion over the entire element.

TG Comp = SUM is not supported for coupled pore-pressure-thermal (CPT nnn ) elements.

X, Y, Z, SUM

Component thermal gradient or vector sum.

TF

X, Y, Z, SUM

Component thermal flux or vector sum.

PG

X, Y, Z, SUM

Component pressure gradient or vector sum.

EF

X, Y, Z, SUM

Component electric field or vector sum.

D

X, Y, Z, SUM

Component electric flux density or vector sum.

H

X, Y, Z, SUM

Component magnetic field intensity or vector sum.

B

X, Y, Z, SUM

Component magnetic flux density or vector sum.

CG

X, Y, Z, SUM

Component concentration gradient or vector sum.

DF

X, Y, Z, SUM

Component diffusion flux density or vector sum.

FMAG

X, Y, Z, SUM

Component electromagnetic forces or vector sum.

SERR

Structural error energy.

SDSG

Absolute value of maximum variation of any nodal stress component.

TERR

Thermal error energy.

TDSG

Absolute value of the maximum variation of any nodal thermal gradient component.

F

X, Y, Z

Component structural force. Sum of element nodal values.

M

X, Y, Z

Component structural moment. Sum of element nodal values.

HEAT

Heat flow. Sum of element nodal values.

FLOW

Fluid flow. Sum of element nodal values.

AMPS

Current flow. Sum of element nodal values.

FLUX

Magnetic flux. Sum of element nodal values.

CSG

X, Y, Z

Component magnetic current segment.

RATE

Diffusion flow rate. Sum of element nodal values.

SENE

“Stiffness” energy or thermal heat dissipation (applies to all elements where meaningful). Same as TENE.

AENE

Artificial energy of the element. This includes the sum of hourglass control energy and energy generated by in-plane drilling stiffness from shell elements (applies to all elements where meaningful). It also includes artificial energy due to contact stabilization. The energy is used for comparisons to SENE energy to predict the solution error due to artificial stiffness.

TENE

Thermal heat dissipation or “stiffness” energy (applies to all elements where meaningful). Same as SENE.

KENE

Kinetic energy (applies to all elements where meaningful).

ASENE

Amplitude “stiffness” energy.

PSENE

Peak “stiffness” energy.

AKENE

Amplitude kinetic energy.

PKENE

Peak kinetic energy.

DENE

Damping energy.

WEXT WEXT is calculated for element-based loading only (and not for nodal-force loading). WEXT is stored on elements to which loading has been applied; if surface elements are added on top of other elements, for example, and pressure loading is applied to the surface elements, WEXT is available for the surface elements only.

Work due to external load.

STEN

Elemental energy dissipation due to stabilization.

JHEAT

Element Joule heat generation.

JS

X, Y, Z, SUM

Source current density for low-frequency magnetic analyses. Total current density (sum of conduction and displacement current densities) in low frequency electric analyses. Components (X, Y, Z) and vector sum (SUM).

JT

X, Y, Z, SUM

Total measurable current density in low-frequency electromagnetic analyses. (Conduction current density in a low-frequency electric analysis.) Components (X, Y, Z) and vector sum (SUM).

JC

X, Y, Z, SUM

Conduction current density for elements that support conduction current calculation. Components (X, Y, Z) and vector sum (SUM).

MRE

Magnetics Reynolds number.

VOLU

Element volume. Based on unit thickness for 2D plane elements (unless the thickness option is used) and on the full 360 degrees for 2D axisymmetric elements.

CENT

X, Y, Z

Undeformed X, Y, or Z location (based on shape function) of the element centroid in the active coordinate system.

BFE

TEMP

Body temperatures (calculated from applied temperatures) as used in solution (area and volume elements only).

SMISC

snum

Element summable miscellaneous data value at sequence number snum (shown in the Output Data section of each applicable element description).

NMISC

snum

Element non-summable miscellaneous data value at sequence number snum (shown in the Output Data section of each applicable element description).

SURF

snum

Element surface data value at sequence number snum.

CONT

STAT

Contact status: * 3 = closed and sticking * 2 = closed and sliding * 1 = open but near contact * 0 = open and not near contact

PENE

Contact penetration (zero or positive).

PRES

Contact pressure.

SFRIC

Contact friction stress.

STOT

Contact total stress (pressure plus friction).

SLIDE

Contact sliding distance.

GAP

Contact gap distance (0 or negative).

FLUX

Total heat flux at contact surface.

CNOS

Total number of contact status changes during substep.

FPRS

Fluid penetration pressure.

TOPO

Densities used for topological optimization.

CAP

C0,X0,K0,ZONE, DPLS,VPLS

Material cap plasticity model only: Cohesion; hydrostatic compaction yielding stress; I1 at the transition point at which the shear and compaction envelopes intersect; zone = 0: elastic state, zone = 1: compaction zone, zone = 2: shear zone, zone = 3: expansion zone; effective deviatoric plastic strain; volume plastic strain.

EDPC

CSIG,CSTR

Material EDP creep model only (not including the cap model): Equivalent creep stress; equivalent creep strain.

ESIG

X,Y,Z,XY,YZ,ZX

Components of Biot``s effective stress.

1, 2, 3

Principal stresses of Biot``s effective stress.

INT

Stress intensity of Biot``s effective stress.

EQV

Equivalent stress of Biot``s effective stress.

DPAR

TPOR

Total porosity (Gurson material model).

GPOR

Porosity due to void growth.

NPOR

Porosity due to void nucleation.

FFLX

X,Y,Z

Fluid flow flux in poromechanics.

FGRA

X,Y,Z

Fluid pore pressure gradient in poromechanics.

FICT

TEMP

Fictive temperature.

PMSV

VRAT, PPRE, DSAT, RPER

Void volume ratio, pore pressure, degree of saturation, and relative permeability for coupled pore-pressure-thermal elements.

YSIDX

TENS,SHEA

Yield surface activity status for Mohr-Coulomb, soil, concrete, and joint rock material models: 1 = yielded, 0 = not yielded.

FPIDX

TF01,SF01, TF02,SF02, TF03,SF03, TF04,SF04

Failure plane surface activity status for concrete and joint rock material models: 1 = yielded, 0 = not yielded. Tension and shear failure status are available for all four sets of failure planes.

NS

X, Y, Z, XY, YZ, XZ

Nominal strain for hyperelastic material, reported in the current configuration (unaffected by rsys ).

MPLA

DMAC, DMAX

Microplane damage, macroscopic and maximum values.

MPDP

TOTA, TENS, COMP, RW

Microplane homogenized total, tension, and compression damages (TOTA, TENS, COMP), and split weight factor (RW).

DAMAGE

1,2,3,MAX

Damage in directions 1, 2, 3 (1, 2, 3) and the maximum damage (MAX).

GDMG

Damage

IDIS

Structural-thermal dissipation rate

BKS

X, Y, Z, XY, YZ, XZ

Total nonlinear kinematic backstress reported in the current configuration (unaffected by rsys ). Available for 3D, plane strain, and axisymmetric elements.

BKS1,…, BKS5

X, Y, Z, XY, YZ, XZ

Superimposed components of the total nonlinear kinematic backstress reported in the current configuration (unaffected by rsys ). Available for 3D, plane strain, and axisymmetric elements when more than one superimposed back-stress component is defined.

EPFR

Free strain in porous media

FC1S

1,2,3,4,5,6

First set of six components of FCC crystal slip. Available for 3D elements only.

FC2S

1,2,3,4,5,6

Second set of six components of FCC crystal slip. Available for 3D elements only.

HC1S

1,2,3,4,5,6

Six components of HCP crystal slip on basal and prismatic systems. Available for 3D elements only.

HC2S

1,2,3,4,5,6

Six components of HCP crystal slip on pyramidal system. Available for 3D elements only.

HC3S

1,2,3,4,5,6

First set of six components of HCP crystal slip on the first-order pyramidal system. Available for 3D elements only.

HC4S

1,2,3,4,5,6

Second set of six components of HCP crystal slip on the first-order pyramidal system. Available for 3D elements only.

HC5S

1,2,3,4,5,6

Six components of HCP crystal slip on the second-order pyramidal system. Available for 3D elements only.

BC1S

1,2,3,4,5,6

First set of six components of BCC slip on 111 plane. Available for 3D elements only.

BC2S

1,2,3,4,5,6

Second set of six components of BCC slip on 111 plane. Available for 3D elements only.

BC3S

1,2,3,4,5,6

First set of six components of BCC slip on 112 plane. Available for 3D elements only.

BC4S

1,2,3,4,5,6

Second set of six components of BCC slip on 112 plane. Available for 3D elements only.

BC5S

1,2,3,4,5,6

First set of six components of BCC slip on 123 plane. Available for 3D elements only.

BC6S

1,2,3,4,5,6

Second set of six components of BCC slip on 123 plane. Available for 3D elements only.

BC7S

1,2,3,4,5,6

Third set of six components of BCC slip on 123 plane. Available for 3D elements only.

BC8S

1,2,3,4,5,6

Fourth set of six components of BCC slip on 123 plane. Available for 3D elements only.

FC1H

1,2,3,4,5,6

First set of six components of FCC crystal hardness. Available for 3D elements only.

FC2H

1,2,3,4,5,6

Second set of six components of FCC crystal hardness. Available for 3D elements only.

HC1H

1,2,3,4,5,6

Sixcomponents of HCP crystal hardness on basal and prismatic systems. Available for 3D elements.

HC2H

1,2,3,4,5,6

Six components of HCP crystal hardness on pyramidal system. Available for 3D elements only.

HC3H

1,2,3,4,5,6

First set of six components of HCP crystal hardness on the first-order pyramidal system. Available for 3D elements only.

HC4H

1,2,3,4,5,6

Second set of six components of HCP crystal hardness on the first-order pyramidal system. Available for 3D elements only.

HC5H

1,2,3,4,5,6

Six components of HCP crystal hardness on the second-order pyramidal system. Available for 3D elements only.

BC1H

1,2,3,4,5,6

First set of six components of BCC hardness on 111 plane. Available for 3D elements only.

BC2H

1,2,3,4,5,6

Second set of six components of BCC hardness on 111 plane. Available for 3D elements only.

BC3H

1,2,3,4,5,6

First set of six components of BCC hardness on 112 plane. Available for 3D elements only.

BC4H

1,2,3,4,5,6

Second set of six components of BCC hardness on 112 plane. Available for 3D elements only.

BC5H

1,2,3,4,5,6

First set of six components of BCC hardness on 123 plane. Available for 3D elements only.

BC6H

1,2,3,4,5,6

Second set of six components of BCC hardness on 123 plane. Available for 3D elements only.

BC7H

1,2,3,4,5,6

Third set of six components of BCC hardness on 123 plane. Available for 3D elements only.

BC8H

1,2,3,4,5,6

Fourth set of six components of BCC hardness on 123 plane. Available for 3D elements only.

XELG

1,2,3,45,6,EQV

Crystal Lagrangian strain in 11, 22, 33, 12, 23,13 directions and its equivalent. Available for 3D elements only.

SINT

RHO, ETA, SSTR, GRAIN

Sintering relative density, viscosity, sintering stress, and average grain size values.

ETABLE - Selected Result Component Labels#

Selected Result Component Labels etable, Lab,SRES, Comp

Comp

Description

SVAR n

The n th state variable.

FLDUF0 n

The n th user-defined field variable.